Abstract
The process of oxidation (OP) that occurs on surfaces of copper (Cu), of electrical connections and connectors of electronic equipments installed in the electronics industry in the northwest of Mexico; is an important factor to determine the corrosion rate (CR) of this metal. The CR obtained from the installation of metallic copper specimens in the companies, one in Ensenada López-Badilla, G. et al. Revista Electrónica Nova Scientia, Nº 7 Vol. 4 (1), 2011. ISSN 2007 - 0705. pp: 01 - 16 - 3 - (marine environment) that manufactures video games, and one in Mexicali (arid zone), which manufactures personal computers; indicated the degree of deterioration of Cu. The CR in each city was determined by the gravimetric method, and increased or maintained of the CR was according to the type of thin films formed on the metals: porous and nonporous films. A correlation of CR with sulfates (SOX) and chlorides (Cl- ) was made, and the data were obtained with the technique of sulfation plates (TPS) and the wet candle method (WCM). The analysis of CR in both cities showed an almost linear representation in Mexicali, indicating the rapidly growing of CR, and in Ensenada a parabolic curve with a slow increase. The corrosion products were characterized by the scanning electron microscopy (SEM) and the Cu films formed with the technique of Auger Electron Spectroscopy (AES), representing the air pollutants that reacted with the copper surface in each city. The analysis of depth profiles show the increases and decreases in carbon, oxygen, sulfates, chlorides and copper, over a period of time, indicating the thickness of each film formed on the surface of Cu, for the OP in the two cities. The maximum value of CR in Ensenada was 188 mg/m2 .year, and in Mexicali was 299 mg/m2 .year.References
AHRAE; Handbook; Heating, Ventilating and Ari-Conditioning; applications. 1999. American Society of Heating. Refrigerating and Air-Conditioning Engineers Inc.
Asami K., Kikuchi M. and Hashimoto K. 1997. An auger electron spectroscopic study of the corrosion behavior of an amorphous Zr40Cu60 alloy. Corrosion Science. Volume 39, Issue 1. pp 95-106.
ASTM G1 – 03. 2003. Standard Practice for Preparing, Cleaning, and Evaluating Corrosion Test Specimens.
ASTM G4 – 01. 2008. Standard Guide for Conducting Corrosion Tests in Field Applications.
ASTM G31 – 72. 2004. Standard Practice for Laboratory Immersion Corrosion Testing of Metals.
ASTM G91–97. 2010. Standard Practice for Monitoring Atmospheric SO2 Using the Sulfation Plate Technique (SPT).
ASTM G140-02. 2008. Standard Test Method for Determining Atmospheric Chloride Deposition Rate by Wet Candle Method (WCM).
Briggs D., Seah M.P. 1990. Practical surface analysis, Second Edition, Volume 1 Auger and XPS, Photoelectron Spectroscopy.Wiley Publishing.
Chunhua X.; Wei G.; Pilling-Bedworth ratio for oxidation of alloys. 2000. Materials Research Innovations. ISSN 1432-8917. Vol. 3. No. 4. pp 231-235.
Clark A. E., Pantan C. G, Hench L. L. 2006. Auger Spectroscopic Analysis of Bioglass Corrosion Films. Journal of the American Ceramic Society; Vol. 59 Issue 1-2, pp 37–39.
G. López., B. Valdez, M. Schorr. 2011. Spectroscopy analysis of corrosion in the electronics industry influenced by Santa Ana winds in marine environments of Mexico. Air Quality Book 4. ISBN (Acepted).
G. López B., B.Valdez, M. Schorr. 2011. Micro and nano analysis of corrosion in steel cans used in the food industry. The Food Industry. Book 1. ISBN 979-953-307-283-7. (Acepted).
ISO 11844-2.2005. Corrosion of metals and alloys - Classification of low corrosivity of indoor atmospheres - Determination and estimation attack in indoor atmospheres. ISO, Geneva.
ISO 11844-1.2006. Corrosion of metals and alloys - Classification of low corrosivity of indoor atmospheres- Determination and estimation of indoor corrosivity. ISO, Geneva.
López, B.G., Valdez, S.B., Zlatev, K. R., Flores, P.J., Carrillo, B.M., Schorr, W. M.. 2007. Corrosion of metals at indoor conditions in the electronics manufacturing industry. Anti-Corrosion Methods and Materials. Vol.54, Issue 6, pp 354-359.
L. Veleva, B. Valdez, G. López, L. Vargas and J. Flores., 2008. Atmospheric corrosion of electro-electronics metals in urban desert simulated indoor environment. Corrosion Engineering Science and Technology, Vol. 43. No. 2. Pp 149-155.ISSN 148-422X.
Moncmanova A. 2007. Environmental Deterioration of Materials, WITPress Publishing, ISBN 978-1-84564-032-3.
López Badilla Gustavo. 2008. Caracterización de la corrosión en materiales metálicos de la industria electrónica en Mexicali, B.C. Tesis de doctorado. UABC, Instituto de Ingeniería, Mexicali, B.C. México.
López G., Tiznado H., Soto G., De la Cruz W., Valdez B., Schorr M., Zlatev R. 2010.Corrosión de dispositivos electrónicos por contaminación atmosférica en interiores de plantas de ambientes áridos y marinos; Nova Scientia, No. 5. Vol. 3(1). ISSN 2007-0705.
López B. G., Valdez S. B., Schorr W. M., Tiznado V. H., Soto H. G. 2010. Influence of climate factors on copper corrosion in electronic equipments and devices, Anti-Corrosion Methods and Materials. Vol. 57. Issue 3. pp 148-152.
López B. Gustavo, Valdez S. Benjamin, Schorr W. Miguel, Zlatev R., Tiznado V. Hugo, Soto H. Gerardo, De la Cruz W.. 2011. AES in corrosion of electronic devices in arid in marine environments; , AntiCorrosion Methods and Materials. (Acepted).
Van Ingelgem Y., Vandendael I.,Vereecken J., Hubin A.. 2007. Study of copper corrosion products formed during localized corrosion using field emission Auger electron spectroscopy, Surface and Interface Analysis, Volume 40 Issue 3-4, pp 273–276.
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